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| PD- 5.042 PRELIMINARY CPV364M4K Short Circuit Rated UltraFast IGBT 1 3 Q1 D1 9 4 6 Q2 D2 12 Q4 D4 18 Q3 D3 15 10 Q6 D6 Q5 D5 16 IGBT SIP MODULE Features * Short Circuit Rated UltraFast: Optimized for high operating frequencies >5.0 kHz , and Short Circuit Rated to 10s @ 125C, VGE = 15V * Fully isolated printed circuit board mount package * Switching-loss rating includes all "tail" losses * HEXFREDTM soft ultrafast diodes * Optimized for high operating frequency (over 5kHz) See Fig. 1 for Current vs. Frequency curve 7 13 19 Product Summary Output Current in a Typical 20 kHz Motor Drive 11 ARMS per phase (3.1 kW total) with TC = 90C, T J = 125C, Supply Voltage 360Vdc, Power Factor 0.8, Modulation Depth 115% (See Figure 1) Description The IGBT technology is the key to International Rectifier's advanced line of IMS (Insulated Metal Substrate) Power Modules. These modules are more efficient than comparable bipolar transistor modules, while at the same time having the simpler gate-drive requirements of the familiar power MOSFET. This superior technology has now been coupled to a state of the art materials system that maximizes power throughput with low thermal resistance. This package is highly suited to motor drive applications and where space is at a premium. IMS-2 Absolute Maximum Ratings Parameter VCES IC @ TC = 25C IC @ TC = 100C ICM ILM tsc VGE VISOL PD @ TC = 25C PD @ TC = 100C TJ TSTG Collector-to-Emitter Voltage Continuous Collector Current Continuous Collector Current Pulsed Collector Current Clamped Inductive Load Current Short Circuit Withstand Time Gate-to-Emitter Voltage Isolation Voltage, any terminal to case, 1 min Maximum Power Dissipation, each IGBT Maximum Power Dissipation, each IGBT Operating Junction and Storage Temperature Range Soldering Temperature, for 10 sec. Mounting torque, 6-32 or M3 screw. Max. 600 24 13 48 48 9.3 20 2500 63 25 -55 to +150 300 (0.063 in. (1.6mm) from case) 5-7 lbf*in ( 0.55-0.8 N*m) Units V A s V VRMS W C Thermal Resistance Parameter RJC (IGBT) RJC (DIODE) RCS (MODULE) Wt Junction-to-Case, each IGBT, one IGBT in conduction Junction-to-Case, each diode, one diode in conduction Case-to-Sink, flat, greased surface Weight of module Typ. --- --- 0.10 20 (0.7) Max. 2.0 3.0 --- --- Units C/W g (oz) 7/18/97 CPV364M4K Electrical Characteristics @ TJ = 25C (unless otherwise specified) V(BR)CES V(BR)CES/TJ VCE(on) VGE(th) VGE(th)/TJ gfe ICES VFM IGES Parameter Min. Collector-to-Emitter Breakdown Voltage 600 Temperature Coeff. of Breakdown Voltage --- Collector-to-Emitter Saturation Voltage --- --- --- Gate Threshold Voltage 3.0 Temperature Coeff. of Threshold Voltage --- Forward Transconductance 11 Zero Gate Voltage Collector Current --- --- Diode Forward Voltage Drop --- --- Gate-to-Emitter Leakage Current --- Typ. --- 0.63 1.80 1.80 1.56 --- -13 18 --- --- 1.3 1.2 --- Max. Units Conditions --- V VGE = 0V, IC = 250A --- V/C VGE = 0V, IC = 1.0mA 2.3 IC = 13A VGE = 15V See Fig. 2, 5 --- V IC = 24A --- IC = 13A, TJ = 150C 6.0 VCE = VGE , IC = 250A --- mV/C VCE = VGE , IC = 250A --- S VCE = 100V, IC = 10A 250 A VGE = 0V, VCE = 600V 3500 VGE = 0V, VCE = 600V, TJ = 150C 1.7 V IC = 15A See Fig. 13 1.6 IC = 15A, TJ = 150C 100 nA VGE = 20V Switching Characteristics @ TJ = 25C (unless otherwise specified) Qg Q ge Q gc t d(on) tr t d(off) tf Eon Eoff Ets t sc t d(on) tr t d(off) tf Ets LE Cies Coes Cres t rr I rr Q rr di(rec)M/dt Parameter Total Gate Charge (turn-on) Gate - Emitter Charge (turn-on) Gate - Collector Charge (turn-on) Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Turn-On Switching Loss Turn-Off Switching Loss Total Switching Loss Short Circuit Withstand Time Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Switching Loss Internal Emitter Inductance Input Capacitance Output Capacitance Reverse Transfer Capacitance Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Diode Reverse Recovery Charge Diode Peak Rate of Fall of Recovery During t b Min. -- -- -- -- -- -- -- -- -- -- 10 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- Typ. Max. Units Conditions 110 170 IC = 13A 14 21 nC VCC = 400V See Fig.8 49 74 VGE = 15V 50 -- 30 -- TJ = 25C ns 110 170 IC = 13A, VCC = 480V 91 140 VGE = 15V, RG = 10 0.56 -- Energy losses include "tail" 0.28 -- mJ and diode reverse recovery 0.84 1.1 See Fig. 9,10, 18 -- -- s VCC = 360V, TJ = 125C VGE = 15V, RG = 10 , VCPK < 500V 47 -- TJ = 150C, See Fig. 11,18 30 -- IC = 13A, VCC = 480V ns 250 -- VGE = 15V, RG = 10 150 -- Energy losses include "tail" 1.28 -- mJ and diode reverse recovery 7.5 -- nH Measured 5mm from package 1600 -- VGE = 0V 130 -- pF VCC = 30V See Fig. 7 55 -- = 1.0MHz 42 60 ns TJ = 25C See Fig. 14 IF = 15A 74 120 TJ = 125C 4.0 6.0 A TJ = 25C See Fig. 15 VR = 200V 6.5 10 TJ = 125C 80 180 nC TJ = 25C See Fig. 220 600 TJ = 125C 16 di/dt = 200As 188 -- A/s TJ = 25C See Fig. 160 -- TJ = 125C 17 CPV364M4K 18 16 14 5.27 4.10 3.51 2.93 2.34 1.76 1.17 0.59 0.00 12 10 8 6 4 2 0 0.1 1 10 100 f, Frequency (KHz) Fig. 1 - Typical Load Current vs. Frequency (Load Current = IRMS of fundamental) 100 100 I C, Collector-to-Emitter Current (A) TJ = 150 C I C, Collector-to-Emitter Current (A) TJ = 150 C 10 10 TJ = 25 C TJ = 25 C 1 1 V GE = 15V 20s PULSE WIDTH 10 1 5 6 7 VCC = 50V 5s PULSE WIDTH 8 9 10 V CE, Collector-to-Emitter Voltage (V) VGE, Gate-to-Emitter Voltage (V) Fig. 2 - Typical Output Characteristics Fig. 3 - Typical Transfer Characteristics Total Output Power (kW) LOAD CURRENT (A) T c = 9 0 C T j = 1 25 C P ow er F ac tor = 0 .8 M o d ula tio n D ep th = 1 .15 V c c = 50 % o f R a ted V o lta g e 4.68 CPV364M4K 25 M a xim um D C C ollecto r C urre nt (A ) V GE = 1 5 V 4.0 VGE = 15V 80 us PULSE WIDTH 20 VCE, Collector-to-Emitter Voltage(V) 3.0 I C = 26A 15 10 2.0 I C = 13A I C = 6.5A 5 0 25 50 75 100 125 A 150 1.0 -60 -40 -20 0 20 40 60 80 100 120 140 160 TC , C ase Te m peratu re (C ) TJ , Junction Temperature ( C) Fig. 4 - Maximum Collector Current vs. Case Temperature Fig. 5 - Typical Collector-to-Emitter Voltage vs. Junction Temperature 10 T herm al R espon se (Z thJC ) 1 D = 0.50 0.20 0.10 0.05 PD M 0 .1 0.02 0.01 t S INGLE PULSE ( TH ERMA L RES PO NSE ) 1 t2 Notes : 1. D uty fac tor D = t 1 /t 2 0.01 0.0000 1 2. P ea k TJ = P D M x Z thJ C + T C 0.0001 0.001 0 .01 0 .1 1 10 t 1 , R e ct an gu la r P uls e D ura tio n (se c ) Fig. 6 - Maximum IGBT Effective Transient Thermal Impedance, Junction-to-Case CPV364M4K 3000 2500 V GE, Gate-to-Emitter Voltage (V) VGE = 0V, f = 1MHz Cies = Cge + Cgc , Cce SHORTED Cres = Cgc Coes = Cce + Cgc 20 VCC = 400V I C = 13A 16 C, Capacitance (pF) 2000 Cies 1500 12 8 1000 500 4 Coes Cres 0 1 10 100 0 0 20 40 60 80 100 120 VCE , Collector-to-Emitter Voltage (V) Q G, Total Gate Charge (nC) Fig. 7 - Typical Capacitance vs. Collector-to-Emitter Voltage Fig. 8 - Typical Gate Charge vs. Gate-to-Emitter Voltage 1.5 VCC = 480V VGE = 15V TJ = 25 C I C = 13A 10 10 RG = Ohm VGE = 15V VCC = 480V IC = 26A Total Switching Losses (mJ) Total Switching Losses (mJ) IC = 13A 1 1.0 IC = 6.5A 0.5 0 10 20 30 40 50 0.1 -60 -40 -20 0 20 40 60 80 100 120 140 160 RG , Gate Resistance (Ohm) RG , Gate Resistance ( ) T J, Junction Temperature ( ) C Fig. 9 - Typical Switching Losses vs. Gate Resistance Fig. 10 - Typical Switching Losses vs. Junction Temperature CPV364M4K 4.0 3.0 I C , C olle ctor-to-E m itter C u rrent (A ) Total Switching Losses (mJ) RG TJ VCC VGE 10 = Ohm = 150 C = 480V = 15V 1000 V GE = 2 0 V TJ = 125C 100 2.0 S AF E O P ER AT IN G AR EA 10 1.0 0.0 0 5 10 15 20 25 30 1 1 10 100 A 1000 I C , Collector-to-emitter Current (A) VC E , C ollector-to -E m itter V oltage (V ) Fig. 11 - Typical Switching Losses vs. Collector-to-Emitter Current 100 Fig. 12 - Turn-Off SOA Inst antan eous F orw ard C urrent - I F (A ) 10 TJ = 15 0C TJ = 12 5C TJ = 2 5C 1 0.8 1.2 1.6 2.0 2.4 Fig. 13 - Maximum Forward Voltage Drop vs. Instantaneous Forward Current F orwa rd V olta ge D rop - V FM (V ) CPV364M4K 100 100 V R= 200V T J = 125C T J = 25C 80 VR = 2 0 0 V T J = 1 2 5 C TJ = 2 5 C I F = 30A I F = 30A 60 I IR R M - (A ) t rr - (ns) 10 IF = 15 A I F = 15A 40 I F = 5 .0A I F = 5.0A 20 100 di f/dt - (A/s) 1000 1 100 1000 di f /dt - (A / s) Fig. 14 - Typical Reverse Recovery vs. dif/dt 800 Fig. 15 - Typical Recovery Current vs. dif/dt 1000 VR = 2 0 0 V T J = 1 2 5 C TJ = 2 5 C 600 VR = 2 0 0 V T J = 1 2 5 C TJ = 2 5 C I F = 3 0A di(re c)M /dt - (A / s) Q R R - (nC ) 400 I F = 5 .0 A I F = 1 5A I F = 3 0A I F = 15A IF = 5.0A 200 0 100 di f /d t - (A /s ) 1000 100 100 1000 d i f /dt - (A /s) Fig. 16 - Typical Stored Charge vs. dif/dt Fig. 17 - Typical di(rec)M /dt vs. dif /dt CPV364M4K 90% Vge + Vg e Same t ype device as D.U.T. V ce Ic 80% of Vce 430F D.U.T. 10 % Vc e Ic 90% Ic 5% Ic td (off) tf E off = t1 +5 S V ce ic d t t1 Fig. 18a - Test Circuit for Measurement of ILM, Eon , Eoff(diode), t rr, Qrr, Irr, t d(on), t r, t d(off), t f t1 t2 Fig. 18b - Test Waveforms for Circuit of Fig. 18a, Defining Eoff, td(off), tf G ATE VO LTA G E D .U .T. 1 0% +V g +V g trr Ic Q rr = trr id dt tx tx 10% V cc V ce Vcc 10% Ic 9 0% Ic DUT V O LTA G E AN D C URR E NT Ipk Ic 10 % Ir r V cc V pk Irr td( on) tr 5% Vc e t2 E on = V c e ie dt t1 t2 DIO D E RE V E RS E RE C O V ER Y EN ER G Y t3 DIO DE RE CO V E RY W AV E FO RM S Er ec = t4 V d id d t t3 t1 t4 Fig. 18c - Test Waveforms for Circuit of Fig. 18a, Defining Eon , td(on), tr Fig. 18d - Test Waveforms for Circuit of Fig. 18a, Defining Erec, trr, Q rr, Irr CPV364M4K V g G ATE S IG N AL DE VICE UNDE R TE S T CURR EN T D .U .T. VO L TA G E IN D.U.T. CURR EN T IN D1 t0 t1 t2 Figure 18e. Macro Waveforms for Figure 18a's Test Circuit L 10 00V 50V 60 00 F 100 V V c* D.U.T. RL = 0 - 480V 480V 4 X I C @25C Figure 19. Clamped Inductive Load Test Circuit Figure 20. Pulsed Collector Current Test Circuit CPV364M4K Notes: Repetitive rating: VGE=20V; pulse width limited by maximum junction temperature (figure 20) VCC=80%(VCES), VGE=20V, L=10H, RG = 10 (Figure 19) Pulse width 80s; duty factor 0.1%. Pulse width 5.0s, single shot. Case Outline IMS-2 62.43 (2.458) 3.91 ( .154) 2X 53.85 ( 2.120) 7.87 (.310) 5.46 ( .215) 21.97 (.865) 1 2 3 4 5 6 7 8 9 10 1 1 1 2 13 14 1 5 1 6 17 18 19 0.38 (.015) NO TE S: 1. Tolerance unless otherwis e spec ified 0.254 (.010) . 2. Controlling D imension: Inch. 3. Dimens ions ar e shown in Millimeter ( Inc hes) . 4. Term inal numbers are shown for refer enc e only. 3.94 (.155) 1.27 ( .050) 3.05 0.38 (.120 .015) 0.76 (.030) 13X 0.51 (.020) 6.10 (.240) 4.06 0.51 (.160 .020) 5.08 (.200) 6X 1.27 (.050) 13X 2.54 (.100) 6X IMS-2 Package Outline (13 Pins) D im e n s io n s in M illim e te rs a n d (In c h e s) WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: K&H Bldg., 2F, 30-4 Nishi-Ikebukuro 3-Chome, Toshima-Ku, Tokyo Japan 171 Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 7/97 |
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